Imec proposes a mix of CMOS, BiCMOS and III-V for datacentre connectivity

Дата публикации: 12-08-2026 05:16:05

Imec has proposed an approach to connectivity inside datacentres which integrates CMOS, BiCMOS and III-V chiplets. It uses cost-effective manufacturing while operating at 100GHz+ frequencies. While Si-CMOS technology offers the […]
The post Imec proposes a mix of CMOS, BiCMOS and III-V for datacentre connectivity appeared first on Electronics Weekly.

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