Data Center Liquid Cooling Manifolds Market by Type (In-rack, RoW-based, Facility-level), Cooling Technology Type (Immersion, Direct to Chip, Hybrid), Data Center Type, Material Type, Design Type, Installation Type, and Region - Global Forecast to 2033..., Market Research Report: MarketsandMarkets

Дата публикации: 30-06-2026 00:00:00

Основное содержимое страницы с новостью.

Data Center Liquid Cooling Manifolds Market by Type (In-rack, RoW-based, Facility-level), Cooling Technology Type (Immersion, Direct to Chip, Hybrid), Data Center Type, Material Type, Design Type, Installation Type, and Region - Global Forecast to 2033

USD 6.33 BN

MARKET SIZE, 2033

OVERVIEW

data-center-liquid-cooling-manifolds-market Overview

Source: Secondary Research, Interviews with Experts, MarketsandMarkets Analysis

The data center liquid-cooling manifolds market is projected to grow from USD 0.94 billion in 2026 to USD 6.33 billion by 2033, at a CAGR of 31.2%. Global demand for the liquid-cooling manifolds market within data centers is expected to experience exponential growth during the projected period from 2026 to 2033 due to the expansion of artificial intelligence, machine learning, and high-performance computing workloads that require increasing power density and are beyond the capabilities of traditional air-cooling methods. As CPUs and GPUs become faster, operators rely increasingly on liquid-cooling and manifold technologies to distribute cooling medium to the necessary hardware with accuracy. Increasingly popular direct-to-chip or immersion cooling techniques increase the demand for highly engineered manifold designs, and the continued construction of hyperscale campuses and colocation facilities necessitates reliable cooling infrastructure that can be scaled appropriately. Growing pressure to reduce carbon footprint by minimizing the amount of energy consumed also drives demand for liquid-cooling solutions as organizations try to improve their power usage effectiveness (PUE) and achieve net-zero emissions goals. Finally, with the capacity designed to support AI becoming the object of growing investments, the use of manifolds as precision cooling equipment will only become increasingly important.

KEY TAKEAWAYS

BY REGION

The North America region is expected to register the highest CAGR of 32.3% during forecast period.
BY MANIFOLD TYPE

By manifold type, the in-rack manifolds segment is projected to grow at the highest CAGR of 33.6% during the forecast period.
BY COOLING TECHNOLOGY TYPE

By cooling technology type, the direct-to-chip cooling segment is projected to register the highest CAGR of 30.8% during the forecast period.
BY DATA CENTER TYPE

By data center type, the hyperscale segment is projected to register the highest CAGR during the forecast period.
BY MATERIAL TYPE

By material type, stainless steel manifolds is likely to account for the largest market share in 2033.
BY DESIGN TYPE

Aisle-mounted design type is likely to hold the majority of market share throughout the forecast period.
BY INSTALLATION TYPE

By installation type, the new installation segment is likely to capture the prominent share in 2033.
Competitive Landscape - Key Players

CoolIT Systems (Ecolab), Vertiv, Parker Hannifin, nVent Electric, GF Industry & Infrastructure were identified as some of the leading players in the data center liquid-cooling manifolds market, given their strong market share and product footprint.
Competitive Landscape - Startups

VAV International, Global Tek Fabrication, Miao Tieh Precision Industrial, and TeraCule, among others, are the leading startups or SMEs because they identify niche gaps early and deliver solutions that precisely match unmet customer needs. Their agility, faster decision-making, and ability to innovate continuously allow them to outperform larger, less flexible competitors.

In terms of forecasts, it can be stated that the market share of liquid-cooling manifolds will exhibit solid growth in global data centers from 2026 to 2033. This growth will be attributed to the growing demand for high-density computing hardware. Because of the rapid advancement in the technology of AI training clusters, cloud computing services, and HPC, it was necessary to develop means of keeping the computing hardware at appropriate temperatures. As such, liquid cooling became a more preferred technique due to its superior cooling capacity than air cooling. However, manifolds are significant when it comes to the use of liquid-cooling technology because manifolds enable proper distribution of the coolant in all the racks and servers. In addition, the growing popularity of direct-to-chip cooling approaches will drive the need for more manifolds.

TRENDS & DISRUPTIONS IMPACTING CUSTOMERS' CUSTOMERS

The data center liquid-cooling manifolds market is experiencing transformation owing to the shift from the use of air-cooling solutions toward more efficient ones such as direct-to-chip and immersion cooling technology solutions. Such changes have necessitated the need for more efficient manifold solutions capable of facilitating optimal flow distribution within high-density computer facilities. The rapid growth in AI-based workload applications, hyperscale cloud infrastructure, and HPC cluster installations has been leading to the increasing adoption of advanced liquid cooling solutions that rely heavily on manifolds as a crucial component. More emphasis is being laid on designing manifold systems specifically designed for closed loop applications, ensuring that there is optimal flow pressure regulation within the system. The increasing reliance on advanced computing systems is driving the demand for liquid manifolds within hyperscale data centers, colocation facilities, and enterprise data centers. More attention is being paid to maintaining reliability and flexibility in systems as it facilitates servicing even when the system is operational. With ongoing developments within liquid-cooling systems, more advanced and highly flexible manifold architecture will be adopted going forward.

data-center-liquid-cooling-manifolds-market Disruptions

Source: Secondary Research, Interviews with Experts, MarketsandMarkets Analysis

MARKET DYNAMICS

OPPORTUNITIES

Impact
Level

Lack of industry-wide standardization and interoperability across cooling infrastructures

Source: Secondary Research, Interviews with Experts, MarketsandMarkets Analysis

There are multiple factors that can explain the fast-growing demand for liquid-cooling manifolds on a global scale. Firstly, the number of recently constructed data centers keeps on increasing year by year, and most of those new facilities fall into one of two categories: hyperscale or colocation data centers. Furthermore, existing data centers are regularly upgraded to cope with current circumstances. With rising heat loads, there appears a necessity to develop some novel cooling technologies to manage temperatures in racks where high-performance devices work. In particular, the development of more complex GPU and AI computing models requires effective coolant delivery, which is performed by means of manifold cooling systems. The growth in the power density of racks leads to an increased need for temperature regulation solutions within data centers. Liquid-cooling architecture, including direct-to-chip and hybrid solutions, is gradually gaining popularity, which is why manifold cooling systems become even more relevant in today's data center market environment.

High capital investment and high implementation cost are the most important constraints in the worldwide market of data center liquid-cooling manifolds. The use of liquid-cooling manifolds involves substantial capital investment in terms of construction and the use of highly sophisticated equipment in the form of piping arrangements and other distribution machinery together with suitable cooling mechanisms. There are high costs involved in the modification of existing air-cooling data centers to accommodate liquid-cooling technologies. There are added costs of designing the system, cost of installation and additional cost associated with skilled labor needed for setting up the system.

AI-ready data center and rack-scale infrastructures are providing an important opportunity for the global data center liquid-cooling manifolds market players. The increasing use of high-density AI loads is leading to the requirement for an effective fluid delivery mechanism at the rack-scale level. Manifold technology is becoming crucial in the provision of even fluid delivery in computing environments. The rise in scalable and modular rack architecture is making the adoption of manifold technology even more prominent. The adoption of liquid cooling by hyperscale facilities for next-gen AI clusters is expected to be a major factor in increasing the demand for manifolds.

A major issue facing the worldwide industry is that of lack of standardization and interoperability, which makes it difficult to connect various parts from different companies due to design and flow difference complications. The lack of universally accepted standards for designs means that more complex designs are required and the need arises to work with proprietary technologies. Thus, the choice of components is limited, as well as the ability to integrate several manufacturers' products in the data center infrastructure. Moreover, it causes delays and adds expenses due to additional customization efforts.

DATA CENTER LIQUID COOLING MANIFOLDS MARKET: COMMERCIAL USE CASES ACROSS INDUSTRIES

COMPANY	USE CASE DESCRIPTION	BENEFITS
	The company produces rack manifolds, which distribute and collect coolant flow in liquid-cooling loops for chips mounted on servers in dense data centers. The manifold system works by using stainless steel header systems with drip-free quick disconnect fittings that provide connection between the header and individual server cold plates' loops inside the rack. These products are used in hyperscale and colocation centers that have high power density racks with fluid delivery to GPU and CPU cold plates higher than 100 kW. The systems work in conjunction with the complete liquid-cooling systems that use CDFs and cold plates. The manifold systems are produced to specifications to fit rack layout and IT stack needs.	This design ensures a consistent coolant flow rate across all cold plate loops in the rack through its precise header configuration \| The system provides dripless maintenance through dry-break quick-disconnect couplings, preventing coolant leakage during server servicing \| It enables rapid installation through color-coded supply and return connections, simplifying assembly and reducing connection errors \| Its all-stainless-steel construction ensures long-term fluid-loop integrity by providing superior resistance to corrosion from water-glycol coolants.
	The company manufactures in-rack manifold systems that regulate the flow of cooling fluid within direct-to-chip liquid cooling systems deployed in data center settings. Manifold systems form part of the company’s rack-level liquid cooling range, which consists of coolant distribution units and fluid network systems. This is meant for use in facilities where there is a need for thermal management of power-dense AI accelerator systems in conventional rack systems. These solutions provide the ability to connect in a top entry and bottom entry manner for coolant flow and allow different coupling sizes depending on the cold plate system used.	The design ensures reliable coolant distribution to and from each server circuit within the rack through its advanced header configuration \| The system simplifies deployment by supporting multiple quick-disconnect coupling designs, enabling seamless integration with existing cold plate solutions from various server manufacturers \| It facilitates scalable liquid-cooling adoption through compliance with NVIDIA reference architecture, establishing a standardized manifold interface across multiple GPU generations \| The leak-free coupling design enables uninterrupted operation by allowing individual server installation or removal without affecting coolant flow to adjacent loops.
	The corporation designs and manufactures coupling systems for quick disconnect technology that functions as the main interface for fluid connections in rack manifolds that are utilized in direct to chip liquid cooling in data centers. The coupling systems work within both the supply and return manifold headers to facilitate the tool-less and leak-proof connection and disconnection of individual server cold plate loops. The couplings are designed according to the Universal Quick Disconnect standards set in collaboration with Intel Corporation and the Open Compute Project to make them compatible across different manifold and cold plates from different manufacturers. The couplings are provided to the manifold manufacturers, system integrators, and original equipment manufacturers, who incorporate the couplings in the rack manifolds.	The solution enables leak-free server insertion and removal through a non-spill coupling mechanism that prevents coolant loss during connector engagement and disengagement \| It ensures multi-vendor compatibility through compliance with the OCP Universal Quick Disconnect specification, standardizing fluid interface dimensions across manifolds and cold plates from different manufacturers \| The tool-free coupling engagement minimizes maintenance downtime by allowing technicians to service individual servers without disrupting the broader cooling loop \| An integrated valve within the coupler provides long-term sealing performance, ensuring reliable and leak-free connectivity throughout the cooling system's operational life \| The availability of multiple coupling diameters supports high coolant flow rates, enabling efficient thermal management across varying server and rack configurations.
	The company develops and manufactures manifolds for rack cooling systems as well as manifold assemblies for thermal cooling systems that help provide cooling fluid distribution and return throughout the liquid cooling system at data centers operating at high densities. These manifolds act within the broader scope of rack-level liquid cooling systems developed by the company that include coolant distribution units as well as rack enclosures that follow the standards defined in the Open Compute Project specifications. These systems can be installed in various forms of configurations such as direct connect via hose-whip as well as jumper hose configurations that offer flexibility with respect to interface connections with cold plates. The systems cater to hyperscale as well as colocation data centers requiring rack level liquid cooling infrastructure that supports AI accelerators operating under high densities.	The system offers flexibility in cold plate integration by supporting a wide range of quick-disconnect couplings, enabling compatibility with diverse server fluid-interface standards \| Its pre-manufactured manifold design reduces on-site installation complexity by eliminating the need to assemble fluid connection components during rack deployment \| The modular architecture supports seamless expansion of cooling infrastructure, allowing additional racks to be connected without disrupting coolant flow to existing servers \| Drip-free coupling technology simplifies maintenance by isolating individual server loops during servicing, preventing coolant leakage and ensuring uninterrupted operation of the remaining cooling network.
	They are providers of integrated piping solutions based on polymers, manifold systems, and rack-level fluid delivery devices that facilitate management of the flow of the cooling liquid in a data center setting for both facility level and rack-level liquid cooling infrastructures. The manifold systems function throughout the entire process of the flow of the coolant from the main coolant distribution unit through secondary network headers up to in-rack points where the liquid flows into the loops of the servers' cold plates. They make use of advanced polymers such as polypropylene and PVDF, making their products chemically resistant, particle-producing, lighter than metallic counterparts. These solutions can be found in hyperscale data centers all over the world and are already operating in large scale AI compute infrastructures around Europe, Asia, and the Americas.	The system reduces the risk of coolant contamination through the use of polymer-based materials that do not generate metallic debris or corrosion byproducts during operation \| Its lightweight polymer construction minimizes mechanical stress on the cooling infrastructure by significantly reducing manifold weight compared to stainless-steel alternatives \| The modular design enables faster data center deployment by supporting off-site fabrication and straightforward integration into primary and secondary cooling loops \| Natural corrosion resistance ensures long-term fluid delivery performance and extends service life regardless of coolant chemistry \| The use of polymer materials supports sustainability objectives by offering a lower carbon footprint than conventional metal-based manifold systems.

Logos and trademarks shown above are the property of their respective owners. Their use here is for informational and illustrative purposes only.

MARKET ECOSYSTEM

The data center liquid-cooling manifolds ecosystem comprises multiple stakeholders that collectively support the design, manufacturing, deployment, and operation of liquid-cooling infrastructure. The value chain begins with raw material suppliers such as Arkema, ArcelorMittal, Nippon Steel, and Alcoa Corporation, which provide polymers, stainless steel, aluminum, and other materials used in manifold production. These materials are utilized by component manufacturers and manifold producers, including Parker Hannifin, CoolIT Systems, GF Industry & Infrastructure, Vertiv, and nVent, to develop coolant distribution systems, connectors, valves, and flow-control components. System integrators and liquid-cooling solution providers then incorporate these manifolds into direct-to-chip, rear-door heat exchanger, and immersion cooling systems. The end users primarily include hyperscale cloud providers, colocation operators, enterprise data centers, and technology companies such as Google, Microsoft, Meta, Amazon Web Services (AWS), and Intel, which deploy liquid-cooling solutions to support AI, high-performance computing (HPC), and high-density server environments while improving energy efficiency and thermal management performance.

data-center-liquid-cooling-manifolds-market Ecosystem

Logos and trademarks shown above are the property of their respective owners. Their use here is for informational and illustrative purposes only.

MARKET SEGMENTS

data-center-liquid-cooling-manifolds-market Segments

Source: Secondary Research, Interviews with Experts, MarketsandMarkets Analysis

In-rack manifolds will dominate the data center liquid-cooling manifolds market due to the fact that all liquid-cooled racks in a DTC configuration will require individual manifolds, meaning the total demand for this type of manifold is directly correlated to the number of GPU racks deployed. Row-based manifolds are emerging as a growing part of the market, as data center owners will increasingly use liquid cooling systems across multiple racks to increase efficiency and simplify installation processes. While facility-level manifolds are responsible for handling the largest flow rates per single unit, they will constitute far fewer individual installations per single data center due to the size limitations of data center floors and will, therefore, not contribute as much to total market size.

The direct-to-chip cooling technology holds the largest market share since it is applicable in greenfield and brownfield data centers and matches reference architectures offered by major GPU platform vendors for AI workloads training and inference. On the other hand, immersion cooling is projected to record the highest CAGR over the forecast period as owners of optimized AI facilities seek better thermal efficiency to be applied to rack densities beyond the capacity of direct-to-chip cooling solutions. Manifolds demand related to hybrid cooling systems increases gradually when enterprises and colocation operators deploy liquid-cooling systems alongside already existing air-cooled racks.

Stainless steel manifolds have held a substantial market share due to its designation as standard material by all major OEM suppliers of direct-to-chip cooling systems in addition to the same being used as a default choice by hyperscale operators in their procurement programs. Polymer-based manifolds are projected to record the fastest CAGR as sustainability policies, contamination concerns, and weight savings mandate the use of engineered polymers in rack manifolds for both rack-level and facility-level installations.

The aisle-mounted design is the most widely adopted design, given its role as the secondary fluid infrastructure in AI data center facilities. Underfloor manifold designs are projected to show the fastest CAGR in the future, considering that many existing raised-floor data centers will have to be retrofitted for liquid cooling purposes, which can be done without major overhead work. As the number of data center construction practices becomes more oriented toward modularization and pre-fabrication of manifolds for fast installation, the choice of design becomes easier to make.

Hyperscale data centers dominate the manifold market as they make up the most significant portion of the capital investment programs that result in high per-site manifold volumes required by multi-gigawatt campus development projects. The rapid expansion of the colocation market is expected to make this data center segment grow faster than others as many providers from North America, Europe, and Asia Pacific region engage in competition to provide liquid-cooled facilities to meet the rapidly increasing demand for AI-powered servers from fast-growing segment of colocation tenants. The adoption of liquid-cooling among enterprise facilities will also grow since more internal AI computing capabilities appear there, together with increased understanding of liquid cooling installations.

New installation is expected to account for the largest share of the data center liquid-cooling manifolds market during the forecast period, primarily driven by the construction of new hyperscale, AI, and high-performance computing (HPC) data centers designed with liquid-cooling infrastructure from the outset. The new installation for AI segment is projected to register the highest CAGR, supported by substantial investments in AI-ready facilities equipped with high-density GPU clusters and server racks exceeding 100 kW. These next-generation facilities require extensive deployment of liquid-cooling manifolds to ensure efficient coolant distribution and thermal management. As data center operators increasingly build purpose-designed AI infrastructure to support generative AI, machine learning, and advanced computing workloads, demand for manifold systems in new installations is expected to accelerate significantly.

REGION

North America to be fastest-growing region in global data center liquid-cooling manifolds market during forecast period

North America is projected to be the fastest-growing region in the global data center manifolds market due to the rapid expansion of hyperscale data centers, AI infrastructure, and high-performance computing facilities. The presence of major cloud service providers and data center operators is accelerating the adoption of advanced liquid-cooling systems. Increasing rack power densities from AI workloads are driving demand for efficient coolant distribution solutions, including manifolds. The region is witnessing significant investments in new data center construction and upgrades of existing facilities with liquid cooling capabilities. The strong presence of leading liquid cooling and thermal management companies is further supporting technology development and deployment. Growing focus on energy efficiency, sustainability, and next-generation data center designs is expected to further boost manifold adoption across North America.

data-center-liquid-cooling-manifolds-market Region

DATA CENTER LIQUID COOLING MANIFOLDS MARKET: COMPANY EVALUATION MATRIX

According to the global data center liquid-cooling manifolds market matrix, CoolIT Systems (Star) is a leading player, offering advanced in-rack manifold systems for direct-to-chip cooling in high-density AI and hyperscale data centers. Its flexible and scalable manifold solutions support efficient coolant distribution and thermal management. Motivair Corporation, a subsidiary of Schneider Electric (Emerging Leader), provides manifold assemblies as part of its liquid-cooling portfolio, enabling reliable fluid distribution and scalable thermal management for enterprise, colocation, and hyperscale data center applications.

data-center-liquid-cooling-manifolds-market Evaluation Metrics

Source: Secondary Research, Interviews with Experts, MarketsandMarkets Analysis

KEY MARKET PLAYERS

CoollT Systems (Canada)
nVent (UK)
Vertiv Group Corp (US)
PARKER HANNIFIN CORP (US)
GF Industry and Infrastructure Flow Solutions (Switzerland)
Scheider Electric (France)
Chilldyne, Inc (US)
Tate Access Floors, Inc (US)
Accelsius LLC (US)
Steel & O'Brien Manufacturing (US)
Envicool (China)
JETCOOL Technologies Inc (US)
Valex (US)
Dockweiler (Germany)
Hanley Controls (Clonmel) Ltd. (Ireland)
DCX Liquid Cooling Systems (Poland)
Boyd (US)
Delta Electronics, Inc. (Taiwan)
KRES POWER SYSTEMS ONTARIO CORPORATION (Canada)
Filsonfilters (China)
Shenzhen Lori Technology Co., Ltd. (China)
TeraCule (Singapore)
VAV International (US)
Global Tek Fabrication Co., Ltd. (Taiwan)
MIAO TIEH PRECISION INDUSTRIAL CO., LTD (Taiwan)

MARKET SCOPE

REPORT METRIC	DETAILS
Market Size in 2025 (Value)	USD 0.66 BN
Market Size in 2026 (Value)	USD 0.94 BN
Market Forecast in 2033 (Value)	USD 6.33 BN
CAGR (2026–2033)	31.2%
Years Considered	2021–2033
Base Year	2025
Forecast Period	2026–2033
Units Considered	Value (USD Billion)
Report Coverage	Revenue forecast, competitive landscape, growth factors, and trends
Segments Covered	By Manifold Type (In-rack Manifolds, Row-based Manifolds, Facility-level Manifolds)
Regions Covered	North America, Europe, Asia Pacific, Middle East & Africa, and South America

WHAT IS IN IT FOR YOU: DATA CENTER LIQUID COOLING MANIFOLDS MARKET REPORT CONTENT GUIDE

data-center-liquid-cooling-manifolds-market Content Guide

DELIVERED CUSTOMIZATIONS

We have successfully delivered the following deep-dive customizations:

CLIENT REQUEST	CUSTOMIZATION DELIVERED	VALUE ADDS
The hyperscale data center wants professional advice on choosing among different manifold designs for AI GPU racks with power dissipation in excess of 100kW per rack.	The research investigates three manifold design options using in-rack stainless steel components and PVDF polymer manifolds to explore applications of direct-to-chip cooling solutions in GPU rack systems with high density.	The firm needs to empower engineers with information to choose optimal manifold designs that would ensure coolant loop integrity with minimal contamination and leakages during rack installation projects.
Market penetration into the market of data center liquid cooling manifolds is being considered by the manifold producer; therefore, it is necessary to perform an analysis of market potential.	Market potential analysis includes product-materials handling capability testing on the stainless steel and plastic manifolds along with competitive analysis on the different levels (in-rack, row-based, and facility-wide manifolds).	The following key areas have been selected as priorities for further actions, and these are areas where the company needs a more differentiated approach towards products, along with identifying high growth opportunities and building better channel-to-market strategy.
The decision being considered here is whether to integrate liquid cooling manifolds into air-cooling facilities operated by a colocation data center provider.	The three main evaluation methods used in this study include retrofit feasibility benchmarking across raised-floor and non-raised-floor facility types and total cost of installation comparison across aisle-mounted and underfloor manifold configurations and operational compatibility assessment against existing rack and power infrastructure.	The organization achieved three outcomes through this analysis which included development of a phased retrofit investment roadmap and creation of capital expenditure and operational expenditure projection models by facility tier and reduction of deployment risk through identification of the manifold configuration most compatible with existing infrastructure constraints.
A venture capital organization has been tasked with analyzing the worldwide data center liquid cooling manifold market in order to aid in making investment decisions.	The analysis indicates that there will be additional advantages in investing based on the combination of data concerning market growth potential and value chain positioning along with information about the competitive structure of the industry in terms of the potential of the leading companies to gain disproportionate revenue from AI-driven market growth potential.	The three main areas which are considered during investment analysis need to be improved regarding the accuracy of revenue projections by manifold category and competitive moat evaluation between integrated systems OEMs and individual components suppliers in the value chain.
The procurement team from a leading global EPC company is seeking to qualify suppliers in both stainless steel manifolds and polymer manifolds for various hyperscale data centers programs.	The research is made up of three major components, which include benchmarking capabilities of the qualified suppliers according to the type of manifold and its material classification among the different configurations in-rack and row-based and the establishment of procurement compatibility standards in line with the OCP quick disconnect specifications and identifying demand patterns of custom-made vs. standard manifolds for hyperscale and colocation projects.	The corporation has benefited from better supplier qualification efforts using two key strategies, which include capability benchmarking and procurement standards development.

RECENT DEVELOPMENTS

March 2026 : CoolIT Systems was acquired by Ecolab, a global leader in water treatment, fluid management, and sustainability solutions, strengthening CoolIT’s position in the liquid-cooling ecosystem. Through this acquisition, CoolIT gains access to Ecolab’s expertise in fluid monitoring, water quality management, and corrosion prevention technologies, enhancing the performance, reliability, and longevity of liquid-cooling manifold systems. The integration of Ecolab’s capabilities is expected to improve coolant quality control, optimize fluid handling, and support advanced monitoring solutions for high-density data center cooling infrastructure.
March 2026 : Eaton Corporation announced the acquisition of the thermal management business of Boyd Corporation in a transaction valued at approximately USD 9.5 billion. This strategic development strengthens Eaton’s position in the data center cooling market by expanding its portfolio of advanced thermal management and liquid-cooling solutions. The acquisition enhances Eaton’s capabilities in supporting high-density and AI-driven data centers, where liquid-cooling manifolds play a critical role in efficient coolant distribution and thermal regulation. By integrating Boyd’s thermal management expertise, Eaton is better positioned to address the growing demand for liquid-cooling infrastructure and reinforce its presence in the rapidly evolving data center cooling ecosystem.
October 2024 : Schneider Electric acquired a controlling stake in Motivair, a leading provider of liquid-cooling and thermal management solutions for high-performance computing (HPC) and data center applications. This strategic acquisition strengthens Schneider Electric’s capabilities in advanced liquid-cooling technologies, enhancing its ability to deliver integrated cooling solutions for high-density and AI-driven data centers. The addition of Motivair’s expertise supports the growing adoption of direct-to-chip cooling architectures, where liquid-cooling manifolds play a vital role in efficient coolant distribution and thermal management. The acquisition also expands Schneider Electric’s end-to-end data center infrastructure portfolio and reinforces its position within the rapidly growing liquid-cooling ecosystem.

Exclusive indicates content/data unique to MarketsandMarkets and not available with any competitors.

MARKET OVERVIEW

Covers the key developments, trend analysis, and actionable insights to support strategic planning and positioning.

4.3

UNMET NEEDS AND WHITE SPACES

4.4

INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES

4.5

STRATEGIC MOVES BY TIER 1/2/3 PLAYERS

INDUSTRY TRENDS

Provides a snapshot of current market scenario, value chain context, and factors impacting competitive intensity.

5.1

PORTER’S FIVE FORCES ANALYSIS

5.1.1

BARGAINING POWER OF SUPPLIERS

5.1.2

THREAT OF NEW ENTRANTS

5.1.3

THREAT OF SUBSTITUTES

5.1.4

BARGAINING POWER OF BUYERS

5.1.5

INTENSITY OF RIVALRY

5.2

MACROECONOMIC OUTLOOK

5.2.2

GDP TRENDS & FORECAST

5.2.3

TRENDS IN GLOBAL DATA CENTER LIQUID-COOLING MANIFOLDS INDUSTRY

5.5

KEY CONFERENCES AND EVENTS, 2026-2027

5.6

TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS

5.7

INVESTMENT AND FUNDING SCENARIO

TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACT, PATENTS, INNOVATIONS, AND FUTURE APPLICATIONS

6.1

KEY EMERGING TECHNOLOGIES

6.2

COMPLEMENTARY TECHNOLOGIES

6.3

TECHNOLOGY/PRODUCT ROADMAP

6.6

IMPACT OF GEN AI/AI ON DATA CENTER LIQUID-COOLING MANIFOLDS MARKET

REGULATORY LANDSCAPE ND SUSTAINABILITY INITIATIVES

7.1

REGIONAL REGULATIONS AND COMPLIANCE

7.1.1

REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS

7.2

SUSTAINABILITY INITIATIVES

7.3

IMPACT OF REGULATORY POLICIES ON SUSTAINABILITY INITIATIVES

CUSTOMER LANDSCAPE AND BUYER BEHAVIOR

8.2

DECISION-MAKING PROCESS

8.3

KEY STAKEHOLDERS INVOLVED IN BUYING PROCESS AND THEIR EVALUATION CRITERIA

8.3.1

KEY STAKEHOLDERS IN THE BUYING PROCESS

8.4

ADOPTION BARRIERS AND INTERNAL CHALLENGES

8.5

UNMET NEEDS OF VARIOUS DATA CENTER TYPES

GLOBAL DATA CENTER LIQUID-COOLING MANIFOLDS MARKET, BY MANIFOLD TYPE (COUNTRY LEVEL)