Samsung Electronics Begins Mass Production of First PCIe 6.0 Enterprise SSD

Дата публикации: 08-07-2026 16:29:16

Samsung Electronics said on July 8 it has begun mass production of the PM1763, its first PCI Express (PCIe) 6.0-based enterprise solid-state drive (eSSD).The PM1763 is the first SSD to combine Samsung's ninth-generation V-NAND with the company's new 4-nanometer PCIe 6.0 controller. The product is de

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Samsung Electronics said on July 8 it has begun mass production of the PM1763, its first PCI Express (PCIe) 6.0-based enterprise solid-state drive (eSSD).

The PM1763 is the first SSD to combine Samsung's ninth-generation V-NAND with the company's new 4-nanometer PCIe 6.0 controller. The product is designed to maximize data processing efficiency through faster read performance and an optimized controller architecture.

The drive supports the Non-Volatile Memory Express (NVMe) 2.1 specification, making it suitable for artificial intelligence (AI) data centers and server infrastructure. NVMe is a data transfer protocol built on the PCIe interface. The PM1763 is available in 4TB, 8TB and 16TB capacities.

PCIe 6.0 adopts Pulse Amplitude Modulation with 4 Levels (PAM4) signaling, doubling data bandwidth compared with PCIe 5.0. The PM1763 delivers up to twice the sequential read and write performance of its predecessor, the PM1753. The 16TB model achieves sequential read and write speeds of up to 28,400 megabytes per second (MB/s) and 21,900 MB/s, respectively.

That is fast enough to transfer a 40GB large language model (LLM) in about 1.4 seconds, based on Meta's Llama 3 70-billion-parameter (70B) model. The higher throughput minimizes data latency between AI accelerators and processors, improving AI computing performance.

During AI training and inference, SSDs deliver massive amounts of data—including AI model datasets and key-value (KV) cache data—to central processing units (CPUs) and graphics processing units (GPUs). Data transfer speed is critical for AI SSDs because uninterrupted data delivery is essential to maintaining computing performance, response times and service quality.

The PM1763 is optimized for next-generation liquid-cooled AI servers. It supports direct-to-chip (D2C) cooling, in which cold plates are attached directly to key components, enabling sustained performance under heavy workloads. Samsung said the new drive is 1.8 times more power-efficient than its predecessor, helping reduce data center operating costs.

Samsung also enhanced the drive's security features. The PM1763 supports post-quantum cryptography (PQC) algorithms to defend against future quantum computing attacks and complies with the TEE Device Interface Security Protocol (TDISP) standard to protect data channels in virtualized environments.

PQC is designed to address vulnerabilities in conventional encryption methods against quantum computers. TDISP is a security standard that prevents unauthorized access when SSDs are assigned and connected in virtualized environments.

"PM1763 has successfully completed customer qualification by meeting the requirements of next-generation AI platforms from global customers," said Choi Jang-seok, vice president of the Product Planning Team in Samsung Electronics' Memory Business. "By expanding memory capacity, the drive will become a key solution for helping customers operate AI models more efficiently."

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